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Bismaleimide resin with low dielectric properties and flexibility [Sample provided]

【Demand in the electronic materials field】This is a new bismaleimide resin varnish that combines low dielectric properties and flexibility. Sample provision is also possible.

The 'ULTIMID 3000S' manufactured by ABC NANOTECH CO., LTD. is a Bismaleimide oligomer with low dielectric properties, which is not hydrolyzed by acids and has stable heat resistance characteristics. 【Features】 ■ Aliphatic Bismaleimide oligomer toluene solution ■ Can be cured at low temperatures (170°C) using peroxide catalysts, etc. ■ Capable of creating uncured films ■ Can be hybridized with other materials such as epoxy resins 【Characteristics as a Cured Product】 ■ The cured product has excellent electrical properties. Dielectric constant: 2.4, Dielectric loss tangent: 0.0016 (10GHz) ■ High flexibility due to the aliphatic backbone. ■ Lower water absorption rate compared to other bismaleimide resins. Water absorption rate: 0.045% ■ High heat resistance. Temperature for 5% weight loss: 436℃ ■ Curing shrinkage rate: 0.1% ■ Low transmission loss (2.5db based on 5cm, LCP is 3.9~4.0db) ◇◇ With the spread of 5G communication, we expect applications in various components for high-frequency use ◇◇ *For detailed explanations and sample requests, please feel free to contact us.